Eliyan
The AI engine Fit Assessment
BetaThe company develops chiplet interconnect technology to enhance AI performance by overcoming the memory wall, enabling scalable and efficient semiconductor solutions for high-performance computing in desktops and data centers.
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Smart insights
- Sean Lundy (Vice President of Global Sales) worked at Seagate Technology for 1.5 years (2014 - 2015)
- Ali Khoshniat (Director of Packaging, Signal and Power Integrity) worked at Dell EMC as @ DSSD - Principal Hardware Engineer - Signal Integrity for 2.5 years (2014 - 2016)
Developer of chiplet interconnect technology system designed to improve AI performance. The company offers a chiplet interconnect technology that eliminates the memory wall, thus improving AI performance by a significant amount focusing on the fundamental challenge of scaling semiconductor performance, size, power, and cost to meet the needs of high-performance computing applications, from desktops to data centers, enabling chip suppliers to create super large SiPs on standard packaging.